R01.00.27
说明:
1.发布RLink_PWB_V2.3版本
(1)The product is initial officially released
(2)RLink_BOM_V2.3.xlsx
(3)RLink_PWB_V2.3
(4)RLink_BOM_V2.2和RLink_BOM_V2.3对比报告
2.发布机架和面板的设计图纸文件
(1)量产主机架+扩展机架图纸
(2)量产主机架+扩展机架面板图
(3)所有面板图(RLink以及COMM、CTRL、空槽等)
3.发布各个模块的新版标签
4.发布COMM_R00.03.05.11.05版本
(1)add supporting access 600(reg) in 38(reg), which support access over coils @38*16=608
(2)add check rtc time before sending to SOC
5.发布CTRL_HW2d0_R02.02.05.06.05版本
(1)aadd "l" to toggle iobus debug print
模块 | ||
名称 | 类型 | 版本号 |
CTRL (801009-000) |
HW | CTRL_HW_V2.0 |
SW | SOC_HW2d0_R02.02.05.06.05 | |
SOC_HW2d0_bootloader_R00.00.08 | ||
COMM (806309-000) |
HW | COMM_HW_V2.1 |
SW | COMM_R00.03.05.11.05 | |
COMM_bootloader_R00.00.00.01.00 | ||
DI (803109-000) |
HW | DI_HW_V2.1 |
SW | DI_1.0(WD)_R02.00.02 | |
DI_2.0(NWD)_R02.02.00 | ||
AI (802109-000) |
HW | AI_HW_V2.1 |
SW | AI_R02.00.01 | |
DO (803209-000) |
HW | DO_HW_V2.0 |
SW | DO_R02.00.00 | |
HIO (804309-000) |
HW | HIO_HW_V2.2 |
SW | HIO_R03.00.00 | |
RLink (806008-000) |
HW | RLink_HW_V2.3 |
SW | RLink_R01.00.00.07.00 | |
RLink_bootloader_R00.00.00.02.00 | ||
HC (809006-000) |
HW | HCBP_HW_V3.0 |
EC (809906-000) |
HW | ECBP_HW_V3.0 |
DITB_NWD (803117-000) |
HW | DITB-NWD_HW_V2.0 |
DITB (803118-000) |
HW | DITB_HW_V2.0 |
AITB (802118-000) |
HW | AITB_HW_V2.0 |
DOTB (803218-000) |
HW | DOTB_HW_V2.0 |
HIOTB (804318-000) |
HW | HIOTB_HW_V3.0 |
DICD (807050-000) |
HW | DICD_HW_V1.0 |
AS |
HW | AS_HW_V1.0 |
LABEL |
HW | LABEL_HW_V1.3 |
TB cable (806042-000) |
HW | TB_cable_5 |
TB_cable_2 | ||
IOBUS cable (806040-000) |
HW | IOBUS cable |
M12 cable (806041-000) |
HW | M12 cable |
I/O空槽面板 (809000-000) |
HW | I/O空槽面板 |
CTRL/COMM空槽面板 (809001-000) |
HW | CTRL/COMM空槽面板 |