R01.00.22
说明：
发布CPU_HW_V1.3.5版本：
1.R6,12K 0603 --->16.5k 0603, 使CPU内核电压稳定在1V。
2.4片DDR芯片的RFU1引脚都通过两个1K 0603电阻分别连到GND和VDD1.8，生产时，应焊接R135,R137,R139,R141;不焊接R136,R138,R140,R142。
3.调整扩展以太网口ENC424J600发送端口中间抽头位置，删除L9 60R 0805，增加R143 10R 0603。
4.BOM中DDR型号MT47H64M8SH-25E IT:H--->MT47H128M8SH-25E IT:M。
| 模块 | ||
| 名称 | 类型 | 版本号 |
|
CPU (501019-000) |
HW | CPU_HW_V1.3.5 |
| CPU_LED_HW_V2.1 | ||
| SW | CPU_V9.11 | |
|
DI (503139-000) |
HW | DI_HW_V2.1 |
| DI_LED_HW_V2.0 | ||
| SW | DI_R00.01.02 | |
|
DO (503239-000) |
HW | DO_HW_V2.1 |
| DO_LED_HW_V2.0 | ||
| SW | DO_R00.01.02 | |
|
AI (502139-000) |
HW | AI_HW_V3.3 |
| AI_LED_HW_V2.0 | ||
| SW | AI_R00.01.02 | |
|
AO (502219-000) |
HW | AO_HW_V2.1 |
| AO_LED_HW_V2.0 | ||
| SW | AO_R00.01.03 | |
|
HSC (502419-000) |
HW | HSC_HW_V1.1 |
| HSC_LED_HW_V2.0 | ||
| SW | HSC_R00.00.03 | |
|
RTD (502519-000) |
HW | RTD_HW_V1.1 |
| RTD_LED_HW_V2.0 | ||
| SW | RTD_R00.00.03 | |
|
CPU_BASE (501016-100) |
HW | CPU_BASE_HW_V2.1 |
| SW | IOLINK_R00.01.03 | |
|
IO_BASE (504306-000) |
HW | IO_BASE_HW_V2.1 |
|
SYSNETBOX (506108-000) |
HW | SYSNETBOX_HW_V2.0 |
|
NET_REDUNBOX (505038-000) |
HW | NET_REDUNBOX_HW_V1.1 |
|
LABEL |
HW | LABEL_V1.1 |
|
AS |
HW | AS_V1.0 |
|
CABLE |
HW | CPU冗余专用线缆_V1.0 |